RAK3272S - RAK3172 Breakout Board - 900mHz

Product Description

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers. Its firmware is based on RAKwireless Unified Interface V3 (RUI3) that allows you create different functionalities using RUI APIs.

For the antenna connection the breakout board has a RP-SMA female connector.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, it has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.4 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you implement your own customized long-range LoRa network quickly.

Please select a variant for your LoRaWAN® region according to this table:

Product Features

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• Module size: 25.4 x 32.3 mm
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range: -40° C ~ 85° C
• 64 KB RAM
• RUI3 API Compatible
• AT Commands Support
• Supported bands: ( AU915, US915, KR920, and AS923)

Product Inclusion

• 1pc RAK3272S Breakout Board
• 1pc LoRa® antenna with RP-SMA female connector
• 18pcs Dupont lines

Documentation

• RAK3272 Breakout Board Datasheet
• RAKwireless Unified Interface V3 (RUI3) Documentation
• RUI3 Best Practices
• RUI3 Tips and Tricks